Time：9:00-12:00，Thurs.,15 August 2013

Venue：Room 468, Lee Hsun Building, IMR

Topic 1: Three-dimensional microfabrication technology and its application

Speaker: Dr. Yi Zhang （张毅） 

　　　　  National Institute of Advanced Industrial Science and Technology, Japan

　　　　  （日本国立产业技术综合研究所）

Topic 2: Void-free filling of via in silicon and polymer

Speaker: Dr. Qingsheng Zhu （祝清省）　

　　　　  Institute of Metal Research, Chinese Academy of Sciences

　　　　 （中国科学院金属研究所）

Tipic 3: Rapid pressureless low temperature sintering of Ag nanoparticles for high power density electronic packaging

Speaker: Dr. Mingyu Li （李明宇）　

　　　　  Harbin Institute of Technology Shenzhen Graduate School

　　　　 （哈尔滨工业大学深圳研究生院）

Tipic 4: Interfacial reaction of low-temperature lead-free solder joint

Speaker: Dr. Zhiquan Liu （刘志权）　

　　　　  Institute of Metal Research, Chinese Academy of Sciences

　　　　 （中国科学院金属研究所）

Welcome to attend!